| Interface M.2 22801 |
PCIe Gen3 8 Gb/s, up to 4 Lanes |
| Formatted Capacity |
250GB |
| NAND Type |
TLC |
| Performance |
- Sequential Read (MB/s) up to (Queues=32, Threads=1) : 3,300
- Sequential Write (MB/s) up to (Queues=32, Threads=1) : 1,200
- Random Read 4KB IOPS up to (Queues=32, Threads=16) : 190K
- Random Write 4KB IOPS up to (Queues=32, Threads=16) : 210K
- Endurance (TBW) 150
|
| Power |
- Average Active Power : 90mW
- Low Power (PS3) : 30mW
- Sleep (PS4) (low power) : 5mW
- Maximum Operating Power : 3.5W
|
| Reliability |
MTTF (hours) : 1.5M |
| Environmental |
- Operating Temperatures : 32°F to 158°F (0°C to 70°C)
- Non-operating Temperatures : -40°F to 185°F (-40°C to 85°C)
- Operating Vibration : 5.0 gRMS, 10–2000 Hz, 3 axes
- Non-Operating Vibration : 4.9 gRMS, 7–800 Hz, 3 axes
- Shock : 1,500 G @ 0.5 msec half sine
- Certifications : BSMI, CAN ICES-3(B)/NMB-3(B), CE, FCC, KCC, Morocco, RCM, TUV, UL, VCCI
|
| Physical Dimensions |
- Form Factor : M.2 2280
- Length : 80 ± 0.15mm
- Width : 22 ± 0.15mm
- Height : 2.38mm
- Weight : 6.5g ± 1g
|
| Warranty |
5 Years |
